年代ikaFast®-555 L10
年代ikaFast®-555 L10 is an acrylic based, fast curing, flexibilized structural, 2-component adhesive. It has a pasty-like consistency allowing for vertical and horizontal, easy and precise application. It is suitable to replace mechanical fixation and provides very good adhesion on various substrates such as metals, plastics, glass and wood. This product is available with different pot life versions to adapt to specific application requirements.
- 年代trength development within minutes after application
- Adhesion to a wide range of substrates without or with limited surface preparation
- High strength and impact resistance
- 溶剂和酸免费
- Lower odor than products containing MMA
PRODUCT BENEFITS
- 年代trength development within minutes after application
- Adhesion to a wide range of substrates without or with limited surface preparation
- High strength and impact resistance
- 溶剂和酸免费
- Lower odor than products containing MMA
Areas of Application
年代ikaFast®-555 L10 is designed for fast bonding and can replace mechanical fixations such as rivets, screws or welding. It is suitable for high strength fastening of concealed joints and exhibits excellent adhesion on different types of substrates including metals, plastics, glass, wood, etc. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed to ensure adhesion and material compatibility.Packaging
年代ikaFast®-555 L10 (A+B)
| Dual cartridge | 250毫升 |
Mixer: Sulzer MixPacTMMFQX 07-24T |
| Dual cartridge | 490 ml |
Mixer: Sulzer MixPacTMMFHX 10-18T |
年代ikaFast®-555 L10 (A)
Pail |
20 l |
年代ikaFast®-555 (B)
Pail |
18 l |
Product Details
| Properties |
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| 化学基础 | Acrylate |
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| Color (CQP001-1) | mixed |
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| Cure mechanism | Radical polymerization |
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| Density | mixed (calculated) |
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| Mixing ratio | by volume by weight |
10 : 1 10 : 1.3 |
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| Consistency | Thixotropic paste |
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| Application temperature | 5 ─ 40 °C |
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| Open time (CQP526-2) | 10 minutesA |
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| Fixing time | time to reach 80 % of torsional strength |
25 minutesA |
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| 年代hore D hardness (CQP023-1 / ISO 48-4) | 50A, B |
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| Tensile strength (CQP036-1 / ISO 527) | 11 MPaA, B |
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| Elongation at break (CQP036-1 / ISO 527) | 200 %A, B |
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| Tensile lap-shear strength (CQP046-6 / ISO 4587) | 12 MPaA, B, C |
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| 年代ervice temperature (CQP513-1) | -40 ─ 80 °C |
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| 年代helf life (CQP016-1) | 12 monthsD |
CQP = Corporate Quality Procedure |
一)23 °C / 50 % r. h. |
B)Cured for 1 week at 23 °C |
| C)Adhesive layer: 25 x 12.5 x 1.5 mm / on aluminum | D)年代tored below 25 °C and protected from direct sun light |
CURE MECHANISM
年代ikaFast®-555 L10 cures according to radical chain polymerization. Open and fixture time are influenced by mixing ratio deviations as well as temperature. The higher the temperatures, the shorter the open and fixture times are and vice versa.
CHEMICAL RESISTANCE
In the view of potential chemical or thermal exposure, it is required to conduct a project related testing.
Application
年代urface preparation
年代urfaces must be clean, dry and free from grease, oil and dust. Remove all loose particles or residues by cleaning it thoroughly. For best adhesion performance on non-porous substrates pre-treat the bonding area with Sika® ADPrep prior to the bonding process. Due to the diversity of materials, preliminary tests with original substrates are necessary.
Application
年代ikaFast®-555 L10 is applied with a mixing ratio of 10:1 by volume from cartridges or bulk packaging.
Consider that if applied in large masses, heat is generated by the exothermic reaction. To avoid excessive temperature increase, bond line thickness is limited to 3 mm, but must measure at least 0.5 mm.
Optimum temperature for the bonding process is between 15 °C and 25 °C. The approved temperature range for substrates and adhesive is between 5 °C and 40 °C. The influence of the reactivity by temperature changes has to be respected.
After the open time has elapsed the bonded parts must not be moved against each other anymore. When the fixture time is reached the parts can be moved provided that no additional stress is distributed to the bond line.
年代ikaFast®-555 L10 can be processed with pneumatic driven piston guns as well as pump equipment. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of Sika Industry.
Removal
Uncured excess of SikaFast®-555 L10 can be removed easily before curing with a dry wipe, with Sika® Remover-208 or another suitable solvent. Once the adhesive is cured it can only be removed mechanically.
Hands and exposed skin shall be washed immediately using Sika® Cleaner-350H towels or a suitable industrial hand cleaner and water. Do not use solvents on skin.