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SikaForce®-100 CT14

1-component adhesive for panel bonding

SikaForce®-100 CT14 is a foaming, moisture curing 1-component polyurethane adhesive for bonding sandwich panels and similar constructions of various materials.

  • Good strength at low coat weights
  • 高发泡、填补空白,reinfo扩大rce
  • Better utilization, low waste remaining in packaging
  • Easily processed, can be pumped easily
  • Solvent free
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PRODUCT BENEFITS

  • Good strength at low coat weights
  • 高发泡、填补空白,reinfo扩大rce
  • Better utilization, low waste remaining in packaging
  • Easily processed, can be pumped easily
  • Solvent free

Areas of Application

SikaForce®-100 CT14 is used primarily for bonding sandwich panels with skin materials of pre-treated or primed aluminum, steel, glass fiber reinforced plastic and core materials of plywood, wood, extruded / expanded polystyrene and mineral wool. This product is suitable for experienced professional users only. Tests with actual substrates and conditions have to be performed, ensuring adhesion and material compatibility.

Product Details

Typical Product Data
Chemical base

Polyurethane
Color (CQP001-1)

Brown
Cure mechanism

Moisture curing
Density (uncured)

1.11 g/cm3
Consistency

Liquid
Solid content

100 %
Viscosity (CQP029-4)

Rheometer, PP25, shear rate 10 s-1, d=1 mm

6 200 mPa∙sA
Application temperature

15 – 30 °C
Open time (CQP591-1)

5 minutesA
Curing time (CQP591-1)

14 minutesA
Gross calorific potential (EN ISO 1716)

29.8 MJ/kg
Shelf life

6 months

CQP = Corporate Quality Procedure

A)23°C / 50% r.h.合著

Technical Information

CURE MECHANISM

The curing of SikaForce®-100 CT14 takes place by chemical reaction between the adhesive and moisture. Higher temperatures speed up the curing process and lower slow it down.

CHEMICAL RESISTANCE

In case of chemical or thermal exposure, conduct project related testing.

Application

Application Information

Surface preparation

Surfaces must be clean, dry and free from grease, oil, dust and contaminants. After the cleaning process, a physical or chemical pre-treatment might be required, depending on surface and type of material. The type of pre-treatment must be determined by tests.
During the curing process, carbon dioxide is released from the adhesive. If none of the substrates are porous, measures need to be taken to allow the carbon dioxide to escape.

Application

Typically a coat weight between 100 and 300 g/m2is applied, depending on the substrates to be bonded. The specific coat weight for a given substrate combination must be determined by tests.
SikaForce®-100 CT14 is a moisture curing adhesive and a water mist of approx. 10 % of the adhesive coat weight, sprayed either on the adhesive or the bond face, is required. SikaForce®-100 CT14 is well suited for automatic applications.
For manual application, apply with trowel, spray water mist on the surface and press parts together before the end of the open time.
For support on selecting and setting up a suitable pump system, contact System Engineering Department of Sika Industry.

Pressing

An adequate bonding pressure is necessary to obtain a voidless contact between the substrates and the adhesive. The specific pressure is, however, dependent on the core material and must be determined by tests. The pressure must always be below the maximum compressive strength of the core. After starting the press process, do not release the pressure until the press time has elapsed.

Removal

Uncured SikaForce®-100 CT14 may be removed from tools and equipment with SikaForce®-096 Cleaner (former SikaForce®-7260 Cleaner). Once cured, the material can only be removed mechanically.
Hands and exposed skin have to be washed immediately using hand wipes such as Sika® Cleaner-350H or a suitable industrial hand cleaner and water.

Do not use solvents on skin.

STORAGE CONDITIONS

SikaForce®-100 CT14必须保持在10°C之间nd 30 °C in a dry place. Do not expose it to direct sunlight or frost. After opening of the packaging, the content has to be protected against humidity.
Minimum temperature during transportation is -20 °C for max. 7 days.